Two-component adhesive（for steel plate） RD621(1:1)

Product Usage:

Suitable for cutting and grinding of photovoltaic, solar monocrystalline silicon, polycrystalline silicon, semiconductor, etc.

The product used in the diamond wire cutting silicon rod is used for bonding between "iron plate + support plate", suitable for

For manual and automated bonding processes.

    

Features:

Boiled and degummed is safe and environmentally friendly with no pungent odor.

    

Product performance indicators:

Serial number

project

    

Technical Parameters

1 chemical composition

2 colors A: white, B: blue, A+B: blue

3 specific gravity A: 1.25 ± 0.10, B: 1.20 ± 0.10, A + B: 1.23 ± 0.10

4 Viscosity (25CPas) A: 25000±5000, B: 400005000, A+B: 33000±5000

5 time (25C) operation time: 8-13mn, movable time: 30-40m, machine time: 3-35h

6 hardness ( Shore D) 83 ± 2

7 tensile strength (MPa) 18 ± 2

8 degumming method, boiling water for 15min

9 adhesive thickness (mm) is best between 0.08to0.1

10 recommended dosage support plate length 700mm, about 60g