Two-component adhesive（for silicon ingot） RD702(1:1)

 Product Usage:

 Suitable for cutting and grinding of photovoltaic, solar monocrystalline silicon, polycrystalline silicon, semiconductor, etc.

 The product used in the diamond wire cutting silicon rod is used for bonding between "ingot + support plate", suitable for

 For manual and automated bonding processes.
 

 Features:

 Low odor, high strength and high hardness. 
 

 Product performance indicators:

 Serial number project technical parameters

 1 chemical composition epoxy resin

 2 color A: white, B: red, A+B: red

 3 specific gravity A: 1.20 ± 0.10, B: 1.30 soil 0.10, A + B: 1.25 ± 0.10

 4 Viscosity (25C/Pas) A: 30000±5000, B: 50000±5000, A+B: 400005000

 5 time (25 ° C) operating time: 7-12min, movable time: 30-40min, running time: 3-3.5h

 6 hardness ( Shore D) ± 2

 7 tensile strength (MPa) ± 2

 8 degumming hot water degumming (at 60 ° C, lactic acid: water = 1: 2, 600 s)

 9 adhesive thickness (mm)

 Best between 0.08to0.1

 10 recommended dosage support plate length 700mm, about 60g