Product Usage:
Suitable for cutting and grinding of photovoltaic, solar monocrystalline, polycrystalline, semiconductor, etc.
The product that is applied to the wire cutting silicon rod is used for bonding between "iron plate + support plate", suitable for artificial
And automated bonding process.
Features:
Easy to operate, fast curing, easy to remove glue.
Product performance index
Serial number project technical parameters
1 chemical composition acrylic resin
2 color (visual) brown red liquid
3 specific gravity 1.10 ± 0.10
4 viscosity (25 ° CC / Pas) 300
5 time (25 ° C) operating time 15, movable time 30S, running time 2h
6 tensile strength (MPa) 16 ± 2
7 degumming method boiling water 500s
8 adhesive thickness (mm) is best between 0.05to0.07
9 recommended dosage support plate length 700mm, about 30g