One component adhesive(for silicon ingot) RD902

2019-11-27 Click:

   Product Usage:

   Suitable for cutting and grinding of photovoltaic, solar monocrystalline silicon, polycrystalline silicon, semiconductors, etc.

   The product used for the wire cutting of the silicon rod is used for bonding between the "ingot + support plate", suitable for artificial

   And automated bonding process.


   1. Curing quickly improves work efficiency, preventing the bright edges and burrs of the silicon wafer caused by uneven mixing of glue;

   2. Can be customized according to customer requirements.

   Product performance index

   No. Item Technical parameters

   1 chemical composition acrylic resin

   2 color (visual) blue liquid

   3 specific gravity 1.05 ± 0.10

   4 viscosity (25 ° C / Pas) 1000

   5 time (25 ° C) operating time 15s, movable time 30s, running time 2h

   6 tensile strength (MPa) 18 ± 2

   7 degumming hot water degumming (at 60 ° C, lactic acid: water = 1: 2, 300 s)

   8 adhesive thickness (mm) is best between 0.05to0.07

   9 recommended dosage support plate length 700mm, about 30g

XML 地图